Koch-Chemie - Micro Cut Pad V2 - Special Sponge for Removing Fine Scratches, Holograms, and Polishing Marks; High Stability; Long-Lasting Compression Hardness; Contours Easily (126mm x 23mm) (Hard)
High-quality foam sponge for removing fine scratches, holograms, and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01.
The short 23mm height creates low torsion forces, very good handling, and the highest level of stability; and the dense foam material enables long-lasting compression hardness during polishing.
The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors.
The milling edge ensures extra flexibility for the pads, enabling them to fit around contours more easily.
EXCELLENCE FOR EXPERTS -Since 1968, Koch‑Chemie stands for high-quality cleaning and care products in the fields of washing chemistry, vehicle preparation, workshops, and industry.
